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powercap/intel_rapl: Support multi-die/package

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RAPL "package" domains are actually implemented in hardware per-die.
Thus, the new multi-die/package systems have mulitple domains
within each physical package.

Update the intel_rapl driver to be "die aware" -- exporting multiple
domains within a single package, when present.  No change on single
die/package systems.

Signed-off-by: Zhang Rui <[email protected]>
Signed-off-by: Len Brown <[email protected]>
Signed-off-by: Thomas Gleixner <[email protected]>
Reviewed-by: Ingo Molnar <[email protected]>
Acked-by: Rafael J. Wysocki <[email protected]>
Acked-by: Peter Zijlstra (Intel) <[email protected]>
Cc: [email protected]
Link: https://lkml.kernel.org/r/9fcb4719aeb7efccf3bc75ed8dd559e46121649f.1557769318.git.len.brown@intel.com
This commit is contained in:
Zhang Rui authored and Thomas Gleixner committed 2019-05-23 10:08:32 +02:00
1 parent aadf7b3833
commit 32fb480e0a
1 file changed
+2 -2
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drivers/powercap/intel_rapl.c
+2 -2
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@@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */
/* caller to ensure CPU hotplug lock is held */
static struct rapl_package *rapl_find_package_domain(int cpu)
{
int id = topology_physical_package_id(cpu);
int id = topology_logical_die_id(cpu);
struct rapl_package *rp;
list_for_each_entry(rp, &rapl_packages, plist) {
@@ -1459,7 +1459,7 @@ static void rapl_remove_package(struct rapl_package *rp)
/* called from CPU hotplug notifier, hotplug lock held */
static struct rapl_package *rapl_add_package(int cpu)
{
int id = topology_physical_package_id(cpu);
int id = topology_logical_die_id(cpu);
struct rapl_package *rp;
int ret;